The STM32F103xF and STM32F103xG performance line family incorporates the high-performance ARMCortex-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 1Mbytes and SRAM up to 96 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer 3x12-bit ADCs, ten general purpose 16-bit timers plus 2xPWM timer, as well as standard and advanced communication interfaces: up to 2x I2Cs and 3x SPIs, 2x I2Ss, 1x SDIO, 5x USARTs, an USB and a CAN. The devices operate from a 2.0 to 3.6 V power supply. They are available in both the -40 to +85 °C temperature range and the -40 to +105 °C extended temperature range. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F103xF/G high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems and video intercom. Key Features ARM32-bit Cortex-M3 CPU Core -72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access -Single-cycle multiplication and hardware division Memories -768 Kbytes to 1 Mbyte of Flash memory -96 Kbytes of SRAM -Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories -LCD parallel interface, 8080/6800 modes Clock, reset and supply management -2.0 to 3.6 V application supply and I/Os -POR, PDR, and programmable voltage detector (PVD) -4-to-16 MHz crystal oscillator -Internal 8 MHz factory-trimmed RC -Internal 40 kHz RC -32 kHz oscillator for RTC with calibration Low-power -Sleep, Stop and Standby modes -VBAT supply for RTC and backup registers 3 x 12-bit, 1 µs A/D converters (up to 21 channels) -Conversion range: 0 to 3.6 V -Tripple-sample and hold capability -Temperature sensor 2 × 12-bit D/A converters DMA -12-channel DMA controller -Peripherals supported: timers, ADC, DAC, SDIO, SPIs, I2Cs and USARTs Up to 112 fast I/O ports -51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode -Serial wire debug (SWD) & JTAG interfaces -Cortex -M3 Embedded Trace Macrocell Up to 17 timers -Up to ten 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input -2x16-bit, motor control PWM timer with dead-time generation and emergency stop -2 watchdog timers (Independent and Window) -SysTick timer 24-bit downcounter -2× 16-bit basic timers to drive the DAC Up to 13 communication interfaces -Up to 2 x I2C interfaces (SMBus/PMBus) -Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control -Up to 3 SPIs (18 Mbit/s)2 with I2S interface multiplexed -CAN interface (2.0B Active) -USB 2.0 full-speed interface CRC calculation unit, 96-bit unique ID ECOPACK

The STM32F103xF and STM32F103xG performance line family incorporates the high-performance ARMCortex-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 1Mbytes and SRAM up to 96 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer 3x12-bit ADCs, ten general purpose 16-bit timers plus 2xPWM timer, as well as standard and advanced communication interfaces: up to 2x I2Cs and 3x SPIs, 2x I2Ss, 1x SDIO, 5x USARTs, an USB and a CAN. The devices operate from a 2.0 to 3.6 V power supply. They are available in both the -40 to +85 °C temperature range and the -40 to +105 °C extended temperature range. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F103xF/G high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems and video intercom. Key Features ARM32-bit Cortex-M3 CPU Core -72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access -Single-cycle multiplication and hardware division Memories -768 Kbytes to 1 Mbyte of Flash memory -96 Kbytes of SRAM -Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories -LCD parallel interface, 8080/6800 modes Clock, reset and supply management -2.0 to 3.6 V application supply and I/Os -POR, PDR, and programmable voltage detector (PVD) -4-to-16 MHz crystal oscillator -Internal 8 MHz factory-trimmed RC -Internal 40 kHz RC -32 kHz oscillator for RTC with calibration Low-power -Sleep, Stop and Standby modes -VBAT supply for RTC and backup registers 3 x 12-bit, 1 µs A/D converters (up to 21 channels) -Conversion range: 0 to 3.6 V -Tripple-sample and hold capability -Temperature sensor 2 × 12-bit D/A converters DMA -12-channel DMA controller -Peripherals supported: timers, ADC, DAC, SDIO, SPIs, I2Cs and USARTs Up to 112 fast I/O ports -51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode -Serial wire debug (SWD) & JTAG interfaces -Cortex -M3 Embedded Trace Macrocell Up to 17 timers -Up to ten 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input -2x16-bit, motor control PWM timer with dead-time generation and emergency stop -2 watchdog timers (Independent and Window) -SysTick timer 24-bit downcounter -2× 16-bit basic timers to drive the DAC Up to 13 communication interfaces -Up to 2 x I2C interfaces (SMBus/PMBus) -Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control -Up to 3 SPIs (18 Mbit/s)2 with I2S interface multiplexed -CAN interface (2.0B Active) -USB 2.0 full-speed interface CRC calculation unit, 96-bit unique ID ECOPACK

The STM32F103xC, STM32F103xD and STM32F103xE performance line family incorporates the high-performance ARM Cortex-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN. The STM32F103xC/D/E high-density performance line family operates in the -40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F103xC/D/E high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems video intercom, and HVAC. Key Features Core: ARM 32-bit Cortex-M3 CPU -72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access -Single-cycle multiplication and hardware division Memories -256 to 512 Kbytes of Flash memory -up to 64 Kbytes of SRAM -Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories -LCD parallel interface, 8080/6800 modes Clock, reset and supply management -2.0 to 3.6 V application supply and I/Os -POR, PDR, and programmable voltage detector (PVD) -4-to-16 MHz crystal oscillator -Internal 8 MHz factory-trimmed RC -Internal 40 kHz RC with calibration -32 kHz oscillator for RTC with calibration Low power -Sleep, Stop and Standby modes -VBAT supply for RTC and backup registers 3×12-bit, 1 µs A/D converters (up to 21 channels) -Conversion range: 0 to 3.6 V -Triple-sample and hold capability -Temperature sensor 2×12-bit D/A converters DMA: 12-channel DMA controller -Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs Debug mode -Serial wire debug (SWD) & JTAG interfaces -Cortex-M3 Embedded Trace Macrocell Up to 112 fast I/O ports -51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Up to 11 timers -Up to 4x16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input -2 × 16-bit motor control PWM timers with dead-time generation and emergency stop -2 × watchdog timers (Independent and Window) -SysTick timer: a 24-bit downcounter -2 × 16-bit basic timers to drive the DAC Up to 13 communication interfaces -Up to 2 × I2C interfaces (SMBus/PMBus) -Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) -Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed -CAN interface (2.0B Active) -USB 2.0 full speed interface -SDIO interface CRC calculation unit, 96-bit unique ID ECOPACK packages

ASUS PRIME B760-PLUS Gaming Mainboard Sockel Intel LGA 1700 (Intel B760, ATX, DDR5 Speicher, PCIe 5.0, 3x PCIe 4.0 M.2, Thunderbolt 4, Aura Sync) Intel® LGA 1700 Sockel: Bereit für die 13. und 12. Generation der Inte® Prozessoren Ultraschnelle Konnektivität: PCIe 5.0, drei PCIe 4.0 M.2, Realtek 2.5Gb Ethernet, USB 3.2 Gen 2×2 Type-C®, Front USB 3.2 Gen 1 Type-C® und Thunderbolt™ (USB4®) Header Unterstützung Umfassende Kühlung: VRM-Kühlkörper, M.2-Kühlkörper, PCH-Kühlkörper, Hybridlüfter-Header und Fan Xpert 2&#43, Exklusive Speichertechnologie: ASUS Enhanced Memory Profile II und ASUS OptiMem II Aura Sync RGB-Beleuchtung Integrierte adressierbare Gen 2-Header und Aura RGB-Header für RGB-LED-Streifen, die leicht mit Aura Sync-fähiger Hardware synchronisiert werden können Technische Details Prozessor Prozessorhersteller: Intel Prozessorsockel: LGA 1700 Kompatible Prozessoren: Intel® Celeron®, Intel® Core™ i3, Intel® Core™ i5, Intel® Core™ i7, Intel® Core™ i9, Intel® Pentium® Gold Maximale Anzahl an SMP-Prozessoren: 1 Unterstützte Prozessorsteckplätze: LGA 1700 Speicher Unterstützte Arbeitsspeicher: DDR5-SDRAM Anzahl der Speichersteckplätze: 4 RAM-Speicher maximal: 192 GB Arbeitsspeicher Typ: DIMM Speicherkanäle: Zweikanalig Ohne ECC: Ja Unterstützte Arbeitsspeichergeschwindigkeit: 4800,5000,5200,5400,5600,5800,6000,6200,6400,6600,6800,7000,7200 MHz Unbuffered Speicher: Ja Gewicht und Abmessungen Breite: 305 mm Tiefe: 244 mm Höhe: 36 mm Netzwerk WLAN: Nein Eingebauter Ethernet-Anschluss: Ja Ethernet Schnittstellen Typ: 2.5 Gigabit Ethernet, Schnelles Ethernet, Gigabit Ethernet Interne E/A-Anschlüsse Anzahl USB 2.0 Schnittstellen: 2 USB 3.2 Gen 1 (3.1 Gen 1) Anschlüsse: 2 SATA III Anschlüsse: 4 S/PDIF aus Stecker: Ja Front Panel Audiostecker: Ja Frontpanel-Stecker: Ja ATX Stromstecker (24-pol.): Ja CPU Ventilatorstecker: Ja Zahl der Chassisventilatorstecker: 3 Anzahl Molex Anschlüsse 4pin: 1 EPS Stromstecker (8-pin): Ja Zahl der COM Stecker: 1 TPM-Verbinder: Ja Thunderbolt-Stiftleisten: 1 12-V-Stromanschluss: Ja RGB-LED-Stiftleiste: Ja E/A-Anschlüsse auf der Rückseite Anzahl USB 2.0 Anschlüsse: 2 USB 3.2 Gen 1 (3.1 Gen 1) Anzahl der Anschlüsse vom Typ A: 1 USB 3.2 Gen 2 (3.1 Gen 2) Anzahl der Anschlüsse vom Typ A: 2 Anzahl Ethernet-LAN-Anschlüsse (RJ-45): 1 Anzahl VGA (D-Sub) Anschlüsse: 1 Anzahl HDMI-Anschlüsse: 1 USB 3.2 Gen 2×2 Typ-C Anzahl Anschlüsse: 1 HDMI-Version: 2.1 Anzahl DisplayPort Anschlüsse: 1 DisplayPorts-Version: 1.4 Kopfhörerausgänge: 1 Line-in: Ja Speicher-Controller Unterstützte Speicherlaufwerk-Schnittstellen: M.2, SATA III Unterstützte Speicherlaufwerke: HDD &, SSD Maximale unterstützte Anzahl der HDD: 4 Anzahl der unterstützten Speicherlaufwerke: 7 RAID-Unterstützung: Ja RAID Level: 0, 1, 5, 10 Verpackungsdaten Verpackungsbreite: 328 mm Verpackungstiefe: 266 mm Verpackungshöhe: 53 mm Paketgewicht: 1,2 kg Lieferumfang Mitgelieferte Kabel: SATA Erweiterungssteckplätze PCI-Express x1 (Gen 3.x)-Anschlüsse: 2 PCI Express x16-Steckplätze (Gen 4.x): 1 PCI Express x16-Steckplätze (Gen 5.x): 1 Anzahl der M.2 (M)-Steckplätze: 3 BIOS BIOS-Typ: UEFI AMI BIOS-Speichergröße: 128 Mbit Sonstige Funktionen Gewicht: 760 g Grafik Parallele Verarbeitungstechnologie: Nicht unterstützt Merkmale Komponente für: PC Motherboardformfaktor: ATX Motherboard Chipsatz Familie: Intel Motherboard Chipsatz: Intel B760 Audio Kanäle: 7.1 Kanäle Kühlung: Passiv Energiequelle: ATX Unterstützt Windows-Betriebssysteme: Windows 10 x64, Windows 11

The STM32F103xF and STM32F103xG performance line family incorporates the high-performance ARMCortex-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 1Mbytes and SRAM up to 96 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer 3x12-bit ADCs, ten general purpose 16-bit timers plus 2xPWM timer, as well as standard and advanced communication interfaces: up to 2x I2Cs and 3x SPIs, 2x I2Ss, 1x SDIO, 5x USARTs, an USB and a CAN. The devices operate from a 2.0 to 3.6 V power supply. They are available in both the -40 to +85 °C temperature range and the -40 to +105 °C extended temperature range. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F103xF/G high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems and video intercom. Key Features ARM32-bit Cortex-M3 CPU Core -72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access -Single-cycle multiplication and hardware division Memories -768 Kbytes to 1 Mbyte of Flash memory -96 Kbytes of SRAM -Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories -LCD parallel interface, 8080/6800 modes Clock, reset and supply management -2.0 to 3.6 V application supply and I/Os -POR, PDR, and programmable voltage detector (PVD) -4-to-16 MHz crystal oscillator -Internal 8 MHz factory-trimmed RC -Internal 40 kHz RC -32 kHz oscillator for RTC with calibration Low-power -Sleep, Stop and Standby modes -VBAT supply for RTC and backup registers 3 x 12-bit, 1 µs A/D converters (up to 21 channels) -Conversion range: 0 to 3.6 V -Tripple-sample and hold capability -Temperature sensor 2 × 12-bit D/A converters DMA -12-channel DMA controller -Peripherals supported: timers, ADC, DAC, SDIO, SPIs, I2Cs and USARTs Up to 112 fast I/O ports -51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode -Serial wire debug (SWD) & JTAG interfaces -Cortex -M3 Embedded Trace Macrocell Up to 17 timers -Up to ten 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input -2x16-bit, motor control PWM timer with dead-time generation and emergency stop -2 watchdog timers (Independent and Window) -SysTick timer 24-bit downcounter -2× 16-bit basic timers to drive the DAC Up to 13 communication interfaces -Up to 2 x I2C interfaces (SMBus/PMBus) -Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control -Up to 3 SPIs (18 Mbit/s)2 with I2S interface multiplexed -CAN interface (2.0B Active) -USB 2.0 full-speed interface CRC calculation unit, 96-bit unique ID ECOPACK